Device for separating electronic module assembly



Dec. 10, 1968 R. D. MICHAEL DEVICE FOR SEPARATING ELECTRONIC MODULE ASSEMBLY Filed Sept. 15, 1966 FIG.

Royboun D. Michael,

INVENTOR. MM, 771, W BY M J. W NW M United States Patent 3,414,960 DEVICE FOR SEPARATING ELECTRONIC MODULE ASSEMBLY Rayboun D. Michael, 1404 Elmwood Drive, Huntsville, Ala. 35801 Filed Sept. 13, 1966, Ser. No. 579,802 4 Claims. (Cl. 29-203) The invention described herein is subject to the reservation to the Government of a nonexclusive, irrevocable, royalty-free license in the invention with power to grant licenses for all governmental purposes.

This invention relates to a device for separating a twopart electronic module assembly that is soldered together.

In module assemblies that are soldered together, a need has arisen for a safe means for separating the cover from the base of the assembly without overheating and damaging components therein. Since some components of the assembly will withstand but a minimum amount of heat, a device that utilizes a minimum amount of heat in separating the module assembly is needed.

Therefore, it is an object of this invention to provide a safe means that utilizes a minimum amount of heat in separating a cover from a base of a module assembly which has delicate parts that must not be overheated.

Another object of this invention is to provide a heat sink plate which will absorb a large amount of heat from the module assembly and prevent the components therein from being overheated.

Still another object of this invention is to provide a heat sink plate with a plurality of fastening means thereon which allows a variety of module assemblies of various sizes to be mounted thereon.

Yet another object of this invention is to provide a clamp for clamping the cover of the assembly to enable pressure to be applied in a direction tending to separate the cover from the base of the module assembly.

The need for separating the cover and base of the assembly has been satisfied by providing a plate with fastening means by which the bolts of the base of the assembly may be secured to the plate. An adjustable type clamp is fastened securely to the cover of the assembly, and when heat is applied to a soldered joint of the assembly, pressure is also applied to the clamp in a manner causing the cover and the base of the assembly to separate as the solder in the soldered joint is being heated.

These and other objects of this invention will become more apparent upon consideration of the following detailed description wherein:

FIGURE 1 is a view of the device for separating electronic module assemblies and with a module assembly mounted relative to the device; and

FIGURE 2 is an exploded view of the device and module assembly.

This invention relates to the described portion following.

A metal plate 1 has securing means 3 integral there with which can be mounted to a fixed structure such as a vice. The opposite side of plate 1 has a plurality of metal spacer dowels 5 which are welded to member 1. These spacer dowels 5 are spaced and oriented in such a manner as to allow module assemblies of various sizes to be mounted thereto. A module assembly 7 consisting of two primary parts, a base 9 and a cover 11, has mounted to base 9 permanently extending bolts 13 each of which is threaded. Bolts 13 of base 9 are placed through holes in spacers 5 and plate 1 and are secured to plate 1 by nuts 15. A metal band 17 is located over soldered joint 18 between cover 11 and base 9 of module assembly 7.

A clamp 19 is provided for clamping cover 11. Clamp 19 incldues a contoured U-shaped member 20 wherein one leg of member 20 is a fixed jaw 21. A movable jaw 23 is mounted to the other leg of U-shaped member 20 by means of an adjusting screw 29 which is connected to movable jaw 23 in a conventional manner to allow movable jaw 23 to be adjusted relative to fixed jaw 21 and clamp the cover of module assembly 7. Rubber pads 25 and 27 located on the inside of jaws 21 and 23 are provided for protecting the module assembly 7, and jaws 21 and 23 are contoured to the shape of the cover to provide maximum clamping engagement between the jaws and cover. Clamp 19 has handle 31 provided on the base of U-shaped member 20 to allow pressure to be applied in a direction for separating the cover and base, While soldering iron 33 is used to heat joint 18 of assembly 7.

In operation, once plate 1 is mounted in a vice, module assembly 7 is fastened securely to plate 1 by means of adjusting nuts 15. Clamp 19 is mounted on cover 11 of module assembly 7, and soldering iron 33 is placed in a position adjacent joint 18 of assembly 7 to provide a limited amount of heat. As the solder is gradually heated, pressure is applied upward on handle 31 to cause base 9 to separate from cover 11 with a minimum amount of heat. The heating of the module assembly is held to a minimum by plate 1 and spacer dowels 5 acting as a heat sink to dissipate the heat away from module assembly 7.

It is to be understood that various modifications of the device for separating electronic module assemblies described herein can be resorted to without departing from the spirit of the invention and the scope of the sub-adjoined claims.

The invention claimed is:

l. A device comprising:

(a) a plate with means on one side thereof for securing said plate to a fixed structure and spacer means on the other side thereof adapted to receive bolts in a base of a module assembly to allow the module assembly to be secured to said plate; and

(b) an adjustable type clamp including a U-shaped member wherein one leg of said U-shaped member is a fixed jaw, the other leg of said U-shaped member has a movable jaw attached thereto by means of an adjusting screw for movement toward and away from said fixed jaw to adapt said clamp for clamping a cover of the module assembly, and a handle on the base of said U-shaped member to allow pressure to be applied in a direction for separating the cover from the base of the assembly.

2. A device as set forth in claim. 1 wherein said spacer means are of such a number and so oriented on said plate as to allow module assemblies of various shapes and sizes to be secured thereto.

3. A device as set forth in claim 1 wherein said jaws have rubber pads attached to the inner clamping side for protecting the assembly to be clamped.

4. A device as set forth in claim 1 wherein said spacer means are of such a number and so oriented on said plate as to allow module assemblies of various shapes and sizes to be secured thereto, wherein said jaws have rubber pads attached to the inner clamping side for protecting the assembly to be clamped, and said jaws are contoured to the shape of the cover to provide a maximum clamping engagement between the jaws and cover.

References Cited UNITED STATES PATENTS 1,365,559 l/192l Starks 29-257 3,045,336 7/1962 Northrop et al. 2'9-203 3,058,440 10/1962 Berry 29-203 3,117,370 1/1964 Kauppi et al. 29-206 THOMAS H. EAGER, Primary Examiner.

U.S. Cl. X.R.. 29-259, 491 

1. A DEVICE COMPRISING: (A) A PLATE WITH MEANS ON ONE SIDE THEREOF FOR SECURING SAID PLATE TO A FIXED STRUCTURE AND SPACER MEANS ON THE OTHER SIDE THEREOF ADPATED TO RECEIVE BOLTS IN A BASE OF A MODULE ASSEMBLY TO ALLOW THE MODULE AS SEMBLY TO BE SECURED TO SAID PLATE; AND (B) AN ADJUSTABLE TYPE CLAMP INCLUDING A U-SHAPED MEMBER WHEREIN ONE LEG OF SAID U-SHAPED MEMBER IS A FIXED JAW, THE OTHER LEG OF SAID U-SHAPED MEMBER HAS A MOVABLE JAW ATTACHED THERETO BY MEANS OF AN ADJUSTING SCREW FOR MOVEMENT TOWARD AND AWAY FROM SAID FIXED JAW TO ADAPT SAID CLAMP FOR CLAMPING A COVER OF THE MODULE ASSEMBLY, AND A HANDLE ON THE BASE OF SAID U-SHAPED MEMBER TO ALLOW PRESSURE TO BE APPLIED IN A DIRECTION FOR SEPARATING THE COVER FROM THE BASE OF THE ASSEMBLY. 